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edfas.org 51 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 2 for automated reverse engineering, [1-3] hardware Trojan detection, [4] and counterfeit electronics detection from device to system level. In addition, new countermeasures are being developed at the device and system levels to prevent remote and invasive attacks. The table above relates the capabilities to research areas at FICS. SCAN lab is equipped with advanced imaging and characterization capabilities including dual beam scan- ning electron microscope (SEM) with focused ion beam (plasmaandGa ionbeams), He/Ne ionbeam, x-ray compu- ted tomography, digital optical microscope, photon emissionmicroscope, laser voltage imaging and probing, nanoprobing, electron beam induced current, electron beamabsorbed current, andmore. The tools help lab staff scrutinize security primitives implemented in integrated circuits, such as logic locking and physically unclonable functions, and detect possible vulnerabilities ormalicious circuits implanted by untrusted entities. FICS Research faculty also provide design and device-level hardware security countermeasures to mitigate weaknesses and avoid attacks in new electronic systems. In addition, a new course at FICS called “Physical Inspection and Attacks on ElectroniKs” (PHIKS) offered by Prof. Navid Asadizanjani includes an introduction to the tools men- tioned above and details their use in failure analysis and security applications. The course will focus on physical inspections, physical attacks, reverse engineering, and counterfeit detection of electronics from the device to system level using advanced microscopy, failure analysis techniques combined with image analysis, and machine learning. FICS Research activities are supported through many government and industrial projects, and the institute is a critical research arm in U.S. cybersecurity. Formore information, visit the programwebsite at fics. institute.ufl.eduand the researchportfolioat fics.institute. ufl.edu/research. REFERENCES 1. N. Asadizanjani, M. Tehranipoor, and D. Forte: “PCB Reverse Engineering using Nondestructive X-ray Tomography and Advanced Image Processing,” IEEE Trans. Compon., Packag. Manuf. Technol., 2017, 7 (2), p. 292-299. 2. N. Asadizanjani, S. Shahbazmohamadi, M. Tehranipoor, and D. Forte: “Non-destructive PCB Reverse Engineering using X-ray Micro Computed Tomography,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2015, p. 1-5. 3. E.L. Principe, et al.: “Steps Toward Automated Deprocessing of Integrated Circuits,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2017. 4. N. Vashistha, M.T. Rahman, H. Shen, D.L. Woodard, N. Asadizanjani, and M. Tehranipoor: “Detecting Hardware Trojans Inserted by Untrusted Foundry using Physical Inspection and Advanced Image Processing,” J. Hardw. Syst. Secur., 2018, p. 1-12. *D and ND denote destructive and nondestructive techniques, respectively.