May_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 2 44 thin as 10 microns, imparting a low thermal resistance of 5 − 7 × 10 − 6 K•m 2 /W. It offers superior electrical insulation with a low dielectric constant of 4.5 at 60 Hz as well as a high dielectric strength of 450 volts/mil (for 1/8-in. thick test specimen), both parameters measured at 75°F. As a single component system, EP3UF-1 is more convenient to handle, apply, and store than typical two component adhesive systems. It has anunlimitedworking life at room temperature and cures in 20-30 minutes at 250°F, or 10-15 minutes at 300°F. EP3UF-1 is available for use in 10 and 30 cc syringes, which are compatible with automated dispensing systems. For more information, visit masterbond.com. NEW SOLDER PASTE SUITS MULTIPLE COMPONENT SIZES AND TYPES Henkel Corp., City of Industry, Calif., expanded its temperature-stable Loctite GC solder portfolio with the addition of its latest solder paste, Loctite GC 18. The new material is a low-voiding formula designed for use with multiple component sizes and types, including large, thermally-challenged devices such as MOSFETs, LPBGAs, QFNs, and large array components. Available inType 3 and Type 4 pastes, halogen free, and lead free, Loctite GC 18 provides comprehensive temperature stability benefits. Consistent with other Loctite GC formulations, Loctite GC 18 is stable for one year when stored at 26.5°C and for one month in temperatures up to 40°C. With high Cpk during continuous printing and after four hours of abandon time, Loctite GC 18 is formulated for excellent transfer efficiency and is compatible with challenging surface finishes such as OSP and Ni/Zn-coated copper and HASL. Most importantly, Loctite GC 18 exhibits low void incidents with diverse components including 0201 chip resistors and capacitors, 0.4mmpitch BGAs, SOICs, QFPs, andQFNsmeasuring >10 × 10mm. Thematerial’s voiding performance has been validated with various surface finishes, board sizes, components, atmospheres, reflow profiles, and reflowovens. Notably, the lowvoiding results observed with Loctite GC 18 were achieved with reflow in air. Other air reflow performance attributes include excellent coalescence in long, hot profiles for 0201 and 0.4 mm pitch components, high humidity resistance, minimal hot slump at 190°C, and superior solder joint appearance compared to other Pb-free solder joints. Formore information, visit henkel-northamerica.com . Loctite temperature-stable solder pastes. 2019 FIB SEMMEETING The 12th annual FIB SEM Meeting will be held May 6-7 at George Washington University in Washington, D.C. It will feature presentations, tutorials, and posters by FIB users and vendors, high- lighting new applications and the latest technology. The event offers plenty of technical content as well as opportunities for informal discussions with your FIB colleagues. For more information, visit fibsem.net or email keana.scott@nist.gov . NOTEWORTHY NEWS