May_EDFA_Digital

edfas.org 43 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 2 VLP, SIL lens, FIB, and emission microscopy as well as for accuratedecap for stacked-die andothermulti-chip cases. Furthering its adaptive modeling capabilities, ASAP-1 In Situ now includes an in-line optical microscope capabil- ity. This allows users to monitor and control all aspects of sample prep on the station from start to finish without the need for sample transfer to external imaging and measurement tools. For more information, visit ultratecusa.com. NEW IMAGING TECHNOLOGY FEATURES HIGH SENSITIVITY FOR FAST ANALYSIS OF FOREIGN MATERIALS Horiba Scientific, Piscataway, N.J., announces the release of its new XGT-9000 x-ray analytical microscope (µXRF), which simultaneouslyperforms elemental analysis and optical observation of samples without destroying or contacting them. The XGT-9000 screens foreign objects that often cause problems in the production process of lithium-ion batteries, food, cosmetics, and pharmaceuti- cals. It also analyzes constituent elements in semiconduc- tor ICs and other micro objects. By integrating the features of a high resolution micro- scope and high-intensity x-ray imaging, the XGT-9000 per- forms nondestructive foreign object analysis on samples, switching between high speed analysis mode for rapid screening of foreign objects, and detailed analysis mode using themicrobeams first incorporated in earliermodels. The XGT-9000 is equipped with three types of optical illumination: bright field coaxial, dark field, and transmis- sion. Combining bright field coaxial and dark field illumi- nation enables clear observation of samples with flat or uneven areas, such as semiconductor wafers and films. The XGT-9000 offers accurate and fast foreign object analysis, enabling it to detect both visible foreign objects and invisible ones down to several microns in size. Detecting these single foreign objects with high definition optical images can help drive reductions in defects that cause degradations in performance, appearance, and quality or result in serious mechanical failure. Coaxial x-ray and optical imaging enables pinpoint analysis with no misalignment. High-definition optical images improve the visibility of foreign objects, which have been difficult to observe until very recently. Other improvements include shorter analysis time, enhanced mapping and image processing, as well as ease of combination with other analysis equipment. The software package includes quantitative and qualitative chemical analysis, thickness determination, and image analysis features. For more information, visit horiba.com . Horiba XG-9000 x-ray analytical microscope. CONDUCTIVE UNDERFILL EPOXY Master Bond, Hackensack, N.J., announces EP3UF-1, a new single component epoxy that is not premixed and frozen. Due to its lowviscosity of 5000-15,000 cps, this heat curable thixotropic compound is suitable for underfill as well asmany bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compres- sive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. EP3UF-1 has a thermal conductivity of 9-10 BTU•in/ ft 2 •hr•°F [1.30-1.44W/(m•K)],making it an effective thermal interface material. It contains a special filler with a small particle size that allows it to be applied in bond lines as Application of Master Bond EP3UF-1 single component epoxy.