May_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 2 42 PRODUCT NEWS Ted Kolasa, Northrop Grumman ted.kolasa@gmail.com PRESS RELEASE SUBMISSIONS: MAGAZINES@ASMINTERNATIONAL.ORG NEW SCRIBING STATION ENABLES CLEAN AND FAST SUBSTRATE DOWNSIZING LatticeGear LLC, Beaverton, Ore., announces its new FlexScribe Station, a scribing tool that allows users to make a straight, fine scribe line quickly, easily, and repeat- edly. It is designed to handle the variety of substrates typically encountered in semiconductor and materials research labs: crystalline, off-crystalline and amorphous, silicon, III-V, glass, and sapphire, with substrate sizes ranging from full 200 mm wafers down to 5 mm-sized pieceswithout restrictions onmaterial shape or thickness. FlexScribe is used to prepare samples for analysis or further processing by enabling substrate downsizing to specific dimensions for isolation of site-specific features. It employs a unique scribing mechanism, a tungsten carbidewheel set on a slide shaft that allows a light touch for smooth and easy scribing. It eliminates the need to apply heavy pressure to produce an effective scribe line. The integrated self-healing cleavingmat not only protects the backside of samples, but also provides handy refer- ence marks for positioning the sample, aligning crystal orientation, and defining dimensions. “We designed the FlexScribe to be flexible to any substrate material, simple to operate, and easy to learn, so that anyone in the lab can scribe with precision,” says Efrat Moyal, co-founder of LatticeGear. Flexscribe is easy to clean with IPA or water and is maintenance-free. Because it does not require power or a computer connection, FlexScribe is portable and can be easily moved to locations where it is needed. For more information, visit latticegear.com. EXPANDED TOOLKIT FOR ASAP-1 IN SITU PROCESSING OF MODERN ICs Ultra TecManufacturing Inc., Santa Ana, Calif., recently introduced an expanded software toolkit for its ASAP-1 In Situ 5-axis mill and selected area polishing station. The new software tools enable profiling and processing of the curved and warped surfaces seen in today’s wide array of packaged IC devices. These adaptive techniques expand onASAP-1 InSitu’s uniquebuilt-in through-thickness (RST) spectrometer. In addition to offer- ing a new interactive graphical approach for modeling curvature profiles in both X and Y planes, high reso- lutionmeshmodels can be added to the pro- file to both fine-tune uniformity and pro- duce high-yield pol- ishing results. This suits applications such as ultrathinning for LatticeGear FlexScribe station. ASAP-1 polishing station and mapped surface profile.