May_EDFA_Digital

edfas.org 41 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 2 counterfeit electronic components detectionandanalysis. Tools and Techniques: Deprocessing, package decap- sulation, cross-sectioning, parallel and angle lapping, optical microscopy, radiographic (x-ray) inspection and imaging, scanning electronmicroscope (SEM) inspection/ analysis, burn-in, life testing, HAST, autoclave, stabiliza- tion bake, 85°C/85%RH (85/85) testing, temp cycle (air- to-air), thermal shock, moisture resistance testing, salt spray testing, vibration testing, mechanical shock testing, acceleration testing, solderability testing, confocal scan- ning acousticmicroscopy (C-SAM), energy-dispersive x-ray spectroscopy (EDS, EDX, EDAX, or XRF), AES, electrical characterization andmeasurements (DC, AC, impedance, S-parameters, 1/F noise, thermal noise), time domain reflectometry (TDR), SPICE models extraction and vali- dation of MOS, BJT, diode, JFET, SOI, TFT, HBT, LDMOS, DMOS, IGBT, HEMT, passive devices (inductors, capacitors, resistors), custommademacro-models (sub circuits), and test chip layout design. EMPA Ueberlandstrasse 129 8600 Dübendorf, Switzerland +41 58 765 11 11 ; +41 58 765 4288 peter.jacob@empa.ch empa.ch/web/empa Services Offered: Research to innovations, coating com- petence center, electron microscopy center, center for x-ray analytics, reliability center, and Swiss competence centers for energy research. Tools and Techniques: FEI 235 Strata, FEI 980 Vectra, FEI Helios, Hitachi S4800, Hitachi TM 3030, Zeiss Orion Plus (He-ionenmikroskop), Hamamatsu Phemos 1000 (OBIRCH/ EMMI), Infrarot-Kamera, Flüssigkristall-Ortung, Vereisung, Nikon XTV-160 3-D-Röntgentomografie, high- resolution scanning transmission electron microscopy (<60 Pm), Superedx System, differential phase contrast imaging (DPC and IDPC), tomography (STEM and TEM), electrostatic biprism for electron holography, JEOL JEM2200fs, JEOL ARM200F, FEI Nanosem230, FEI Quanta 650 FEG ESEM, x-ray-based imaging technology (nano and micro-X-CT: 2D, 3D to 4D), x-ray diffraction (XRD, HRXRD) and wide and small angle scattering methods (WAXS, SAXS, XPCI), XPCI (x-ray phase contrast and dark field imaging, x-ray tomography (macro, micro, nano-CT), SC-XRD (single crystal x-ray diffraction), HRXRD, and SAXS. IBM ASSEMBLY AND TEST SERVICES 23 Boulevard de l’Aéroport, Bromont, Canada 450.534.6496 assembly@ca.ibm.com ibm.com/packaging Services Offered: Advanced packaging solutions, semi- conductor test services, mechanical, electrical, and thermal modeling and simulation, analytical services, reliability and failure analysis, MiQro Innovation Col- laborative Center, and IBM research on silicon nanopho- tonic packaging. IC FAILURE ANALYSIS LAB 1719 S. Grand Ave. Santa Ana, CA 92705 949.329.0340 info@icfailureanalysis.com icfailureanalysis.com Services Offered: Nondestructive and destructive failure analysis, material analysis, IC/PCB competitive analysis/ reverse engineering, environmental/reliability testing, and ESD testing. Tools andTechniques: Cross sectioning, chemical/decap- sulation, delayering, EDX, PCB FA, OBIRCH/EMMI, EDX, FIB (plasma/dual), I-V curve trace, ionbeamx-sectionpolisher, optical profiler, probe andnanoprobemeasurement, SAM, SCM, SEM, SIMS, TEM, 2D/3D x-ray, autoclave or pressure cooker test, BLT, die shear test, ESD – charged device model (CDM), ESD – human body model, ESD – machine model, HAST, HTSL, HTOL, burn-in, THB, latch-up test, lead integrity test,markpermanency test,moisture/reflow sensitivity classification, physical dimension measure- ment, preconditioning test, real time thermal profiling, solderability, solder ball shear test (BGA), temperature cycling air-to-air, temperature humidity bias lifetest 85°C/85%, thermal shock, wire bond pull test, and wire bond shear test. INSIGHT ANALYTICAL LABS 11641 Ridgeline Dr., Unit 150 Colorado Springs, CO 80921 719.570.9549 719.637.1207 ial-fa.com/quote-request Services Offered: Electronic failure analysis, PCB reverse engineering, teardown services, construction analysis, inspection services, authenticity counterfeit inspection, wafer lot acceptance, RoHS auditing, and PCB quality auditing. Tools and Techniques: X-ray inspection, 2D real-time and 3D, SAM, optical inspection (dark field, bright field, polarized, high resolution mosaic functionality), electri- cal test equipment, IR microscopy, XRF, FTIR, EDS, hi-pot and insulation resistance testing, cross sectioning of ICs and PCBs (mechanical and FIB), FIB editing, SEM and FE-SEM, dry and wet etching, reactive ion etching, STEM prep and imaging, dye and pry (BGA devices), decapping and depotting (ICs), solderability analysis, PEM, liquid crystal analysis, LIVA/TIVA analysis, thermal imaging, and electrical probing.