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edfas.org 21 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 2 NOTEWORTHY NEWS MICROSCOPY &MICROANALYSIS 2019 MEETING The Microscopy & Microanalysis (M&M) 2019 meeting will be held August 4-8 in Portland, Ore. The scientific program features the latest advances in biological, physical, and analytical sciences as well as techniques and instrumentation. Complementing the program is one of the largest exhibitions ofmicroscopy andmicroanalysis instrumentation and resources in theworld. Educational opportunities include a variety of Sunday short courses, tutorials, workshops, and pre-meeting congresses for early-career scientists. The opening reception offers a networking venue for meeting newpeople in the field and renewing old acquaintances, while the Monday morning plenary session showcases talks from outstanding researchers and recognizes major Society and meeting award winners. In addition, daily poster awards will highlight the best student posters in instrumentation and techniques as well as biological and physical applications of microscopy and microanalysis. M&M is sponsored by the Microscopy Society of America, the Microanalysis Society, and the Microscopical Society of Canada. For more information, visit microscopy.org/MandM/2019. IPFA 2019 The 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2019) will be held July 2-5 in Hangzhou, China. The event will be devoted to the fundamental understanding of the physical mechanisms governing reliability and failure in a large variety of advanced semiconductor devices and the electrical-physical failure analysis techniques, test methodologies, reliability models, simulations, and characterization tools that could be used to reliably identify the root cause of failure and the lifetime of these devices under different stress regimes. The symposium is technically cosponsored by the IEEE Electron Device Society and IEEE Reliability Society. For more information, visit the IPFA website at ipfa-ieee.org . ESREF 2019 The 30th European SymposiumonReliability of ElectronDevices, Failure Physics and Analysis (ESREF 2019) will take place September 23-26 in Toulouse, France, at the Centre de Congrès Pierre Baudis. This international symposium continues to focus on recent developments and future directions in failure analysis, quality and reliability of materials, and devices and circuits for micro, nano, and optoelectronics. It provides the leading European forum for developing all aspects of reliability management and innovative analysis techniques for present and future electronic applications. The host city is a world center for aeronautics as home to an Airbus assembly line. It is also the European capital of the space industry and a leader in France for embedded electronic systems. For more information, visit esref2019.sciencesconf.org. Advertise in Electronic Device Failure Analysis magazine! For information about advertising in Electronic Device Failure Analysis , contact advertise@asminternational.org or call 440.338.5151. Current rate card may be viewed online at asminternational.org/mediakit.