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edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 2 DEPARTMENTS Measuring Temperature in GaN HEM Ts: An Approach Based on Raman Spectroscopy Bertrand Boudart and Yannick Guhel Estimating temperature in GaN HEMTs must be done with high spatial and thermal resolution methods. This article describes a novel technique that combines the benefits of thermoreflectance and classical Raman spectroscopy. ABOUT THE COVER “Dendrites in Oxide.” Photo by Lori Sarnecki, ON Semiconduc- tor, First Place Winner in Black & White Images, 2018 EDFAS Photo Contest. Author Guidelines Author guidelines and a sample article are available at edfas.org . Potential authors should consult the guidelines for useful informa- tion prior to manuscript preparation. 4 10 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS MAY 2019 | VOLUME 21 | ISSUE 2 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS 2 GUEST EDITORIAL Nicholas Antoniou 38 2019 PHOTO CONTEST 39 2019 VIDEO CONTEST 40 DIRECTORY OF FA PROVIDERS Rose Rin g 42 PRODUCT NEWS Ted Kolasa 46 TRAINING CALENDAR Rose Ring 48 LITERATURE REVIEW Mike Bruce 50 UNIVERSITY HIGHLIGHT Navid Asadiza njani 54 GUEST COLUMN Nancy Missert 56 ADVERTISERS INDEX Data-driven Reliability for Datacenter Hard Disk Drives Alan Yang, AmirEmad Ghassami, Elyse Rosenbaum, and Negar Kiyavash This article explores the possibility of evaluating reliability that dependsmore heavily on diagnostic data and analyt- ics and less so on built-in redundancy, with data center HDDs as an example application. 16 For the digital edition, log in to edfas.org, click on the “News/Magazines” tab, and select “EDFA Magazine.” TIVA Measurements with Visible and 1064-nm Lasers Paiboon Tangyunyong and Andrea Rodarte Conventional practice is to use lasers with wavelengths larger than the band gap wavelength of silicon to create localized heating in TIVAmeasurements. This article dem- onstrates that 1064-nm or visible lasers can also be used. 10 4 Failure Risk Assessment of Laser Dio de Stacks for a Martian Application Guillaume Thin, Frédéric Bourcier, and Hervé Moisan During a space mission where repairs are not possible, components must offer very low risk of failure as well as robustness and resilience. This article investigates the laser diode stacks used in the rover in theMars Curiositymission. 22 16 22 The Power of IC Reverse Engineering for Hardware Trust and Assurance Fatemeh Ganji, Domenic Forte, Navid Asadizanjani, Mark Tehranipoor, and Damon Woodward Integrated circuits embedded in everyday devices face an increased risk of tampering and intrusion. Techniques related to reverse engineering can be employed to address the trust and assurance of COTS chips. 30