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edfas.org 49 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 1 MATERIALS ANALYSIS TECHNOLOGY Headquarters (Jubei Lab, Tai-Yuan Science Park, Failure Analysis) 1F, No. 26-2, Tai-Yuan St., Jubei City Hsinchu County, Taiwan 302 R.O.C. 886.3.6116678 sales@ma-tek.com www.ma-tek.com Services Offered: Auto metrology service, electrical failure analysis, FIB analysis, nondestructive analysis, material analysis, surface analysis, packaging/bonding, ESD testing and design service, reliability testing, bench- mark analysis, IP consultancy, and quality management training courses. Tools and Techniques: 2-3D x-ray, SAT, DB-FIB cross- section and imaging, TEM/STEM, SEM/EDS, SIMS-MS, Auger, XRD/XRR, XPS, SCM, ICP-MS, Raman, EMMI, InGaAs, OBIRCH, thermal, EBIC/EBAC, C-AFM, nanoprobing, HTOL, THS, TCT, TS, IR reflow, ESD testing, optical profiler, and IC bonding and packaging. MICROTECH LABS LLC 538 Haggard St., Suite 402 Plano, TX 75074 972.633.0007 contact@fa-mal.com microtechlaboratories.com Services Offered: Failure analysis, reverse engineering, component analysis, PCBA analysis, design debug, and consulting and training. Tools andTechniques: FIBdesign repair, probe paddepo- sition and circuit isolation, SEM, EDX, PEM/EMMI, liquid crystal, 2-3D x-ray, SAM, mechanical probing, reverse engineering-construction analysis, backside sample prep- aration, deprocessing, decapsulation, and cross-section. MSSCORPS CO. LTD Material Science Service (MSS) Hsin-Chu (Headquarters) 1F, No. 27, Pu-ding Rd., Hsin-chu 30072, Taiwan, R.O.C. +886 3 666 3298 service@msscorps.com www.en.msscorps.com Services Offered: Materials analysis, IC circuit repair, decap, EFA analysis, and case study. Tools and Techniques: TEM/EDS, liquid TEM, DB FIB/EDS, TEM sample prep, FIB circuit edit, EMMI, InGaAs, OBIRCH, SEM in situ nanoprobing system, real-time x-ray, andwet/ dry/laser decapsulation. NANOLAB TECHNOLOGIES 1708 McCarthy Blvd. Milpitas, CA 95035 408.433.3320 PC@Nanolab1.com nanolabtechnologies.com Services Offered: Microscopy and imaging, chemical structure characterization, physical failure analysis, elec- trical failure analysis, PCB analysis, bundled services, and consulting services. Tools andTechniques: Circuit edit FIB, electrical FA, EMMI, FMI, backside SOM, ESCA (XPS), FE-SEM (SEM), FIB-SEM, nondestructive imaging, 2-3D x-ray, SAT, sample prepara- tion, argon ion mill, dimpling, TEM and STEM – EELS and EDS, SIMS, XPS (ESCA), ICP-OES, ICP-MS, AES, AFM, and GC-MS. SAGE ANALYTICAL LABS LLC San Diego location 5744 Pacific Center Blvd., Suite 302 San Diego, CA 92121 858.255.8587 info@sagefalab.com sagefalab.com Services Offered: ESD/latch-up testing, comprehensive IC/PCB FA, IC circuit edit, electrical characterization and microprobing, construction analysis, and competitor analysis. Tools and Techniques: Orion2 HD tester, submicron 3D x-ray, RTI MegaTrace, FIB/SEM, SEM/EDS, OPTIFIB-IV, Hitachi milling system, QFI XIVA, TIVA, OBIRCH, PEM, thermal mapping, OM, JetEtcher, MultiProbe MP1 nano- probing system, TDR, RIE, OKOS SAM, FEI Quanta, and solder joint integrity test. Advertise in Electronic Device Failure Analysis magazine! For information about advertising in Electronic Device Failure Analysis, contact Erik Klingerman, National Account Manager; 440.840.9826; Erik.Klingerman@asminternational.org. Current rate card may be viewed online at asminternational.org/mediakit.