February_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 1 48 DIRECTORY OF INDEPENDENT FA PROVIDERS Rose M. Ring, Lam Research rose.ring@lamresearch.com E lectronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. ADVANCED CIRCUIT ENGINEERS LLC 308 S. Abbott Ave. Milpitas, CA 95035 408.719.1617 sales@advancedcircuitengineers.com advancedcircuitengineers.com Services Offered: Frontside and backside FIB circuit edit, dual-beamSEM-FIB imaging and samplepreparation, TEM and STEM imaging, consultations, and FIB layout design. Tools and Techniques: Backside sample preparation for FIB, sub-Å resolution probe-corrected STEM imaging, large area windowless EDS detector (0.45sr), EELS quan- tification andmapping, tomography and holography, ion beam nano-machining, EDX, analysis on small samples and 12-in. wafers. APPLIED BEAMS LLC 14855 SW Murray Schools Dr. Beaverton, OR 97007 503.608.7237 info@appliedbeams.com apppliedbeams.com Services Offered: Sells FIB/SEM consumables and systems, and hyperFIB plasma FIB, and provides micro- machining and analytical services. Tools and Techniques: HyperFIB, SEM, and AFM services. BARNETT TECHNICAL SERVICES LLC 8153 Elk Grove Blvd., Suite 20 Elk Grove, CA 95758 916.897.2441 info@appliedbeams.com appliedbeams.com Services Offered: Technical consulting, product repre- sentation, and business consulting. EAG LABORATORIES 4747 Executive Dr., Suite 700 San Diego, CA 92121 Materials Sciences: 877.809.0939 Engineering Sciences: 877.809.0939 Life Sciences: 888.219.9187 eag.com Services Offered: Testing and characterization, con- sulting and troubleshooting, failure analysis, litigation support, and educational resources. Tools and Techniques: AFM, Auger, dual beam– FIB, RTX, TOF-SIMS, OP, SEM, TEM-STEM, EBSD, DMA, DPA, DSC, RGA, SAM, RTX, TLC, TG-DTA, TG-EGA, TMA, tensiometry, nanoindentation, viscosity, EDS, EELS, FTIR, XPS-ESCA, XRF, Raman, UV-IS, GC, HPLC, TLC, UHPLC, IC, TOF-SIMS, LC-MS-MS, and GC-MS. HI-REL LABORATORIES 6116 N Freya Spokane, WA 99217 509.325.5800 hrlabs.com Services Offered: Failure analysis, destructive physi- cal and materials analysis, SEM qualification, wafer lot acceptance, precision metallographic evaluation, and upgrade services. Tools and Techniques: C-SAM, 2D real-time/3D computed tomography x-ray imaging, SEM imaging, EDS, FTIR, FIB cross sections, optical microscopy, external visual inspec- tion, delid, PIND, bond pull, hermeticity, residual gas analysis, and die shear. MASER ENGINEERING B.V. Capitool 56 7521 PL Enschede P.O. Box 1438 7500 BK Enschede The Netherlands +31 53 480 26 80 info@maser.nl www.maser.nl ServicesOffered: Reliability test, nondestructive analysis, construction analysis, FIB circuit edit, IPC inspection, and advanced failure analysis. Tools and Techniques: OM, 2-3D x-ray analysis, SAM, lock-in thermography, DC parametric test (curve tracing), wet/dry/laser/mechanical decapsulation, conventional/ FIB cross-sectioning, SEM, PEM/EMMI, OBIRCH, PVC, CAFM, micro-probing, FIB/SEM/STEM imaging, and TEM sample prep.