February_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 1 32 ISTFA 2018 HIGHLIGHTS All Things Failure Analysis, in Four Impactful Days Efrat Moyal, ISTFA 2018 General Chair, Lattice Gear efrat.moyal@latticegear.com EDFAAO (2019) 1:32-33 1537-0755/$19.00 ©ASM International ® A s part of the Electronic Device Failure Analysis Society (EDFAS), the International Symposium for Testing and Failure Analysis (ISTFA) gathers failure analysts from around the world for a unique chance to learn from peers, reexamine established viewpoints, see new tools, resolve FA challenges together, and build lasting networking connections. ISTFA 2018deliveredall that andmorewith 944 attend- ees, tutorials, workshops, panel discussion, keynote speakers, and an expo floor featuring 118 exhibits with experts providing live demonstrations. The ISTFA 2018 theme suggested rethinking failure analysis strategies by identifying “Failures Worth Analyzing.” Keynote speakers Mark-Tami Hotta, former CEO of a leading independent automotive testing center, provided insights to the autonomous vehicle field and the “Transformation to Automated Driving,” and Mark Tehranipoor, an expert in hardware security, presented “Hardware Root-of-Trust for Cyber Security: Uncovering the Role of Test and Failure Analysis in Enabling Cyber Defense,” each talk introducing attendees to other ana- lytical paradigms. Spearheaded by Martin Keim, ISTFA co-located for the first timewith the International Test Conference (ITC) with their related theme, “AI TowardAutonomous Testing.” The complementary blend of ISTFA’s practical focus with the more theoretical ITC program gave attendees a broader view of device testing and an opportunity to expand professional networks. This proved to be a successful first-time initiative. Following are some highlights from the event along with individuals who were key to its success. Technical Program: David Grosjean, Butterfly Net- works Inc. The 2018 Technical Programprovidedmany opportu- nities to learn and share. Fromcase studies to emerging FA techniques, presentations covered all aspects of today’s FA. More than 100 excellent presentations and posters— selectedby 37 session chairs, co-chairs, and 92 committee members—were spread over four days in two parallel tracks. The Q&A time following the presentations was especially active this year. NEW Open Panel Discussion: Susan X. Li, Cypress and Renee Parente, AMD New to ISTFA in 2018, the panel discussion began with immediate audience engagement in the form of questions, after a brief introduction from the panelists. Together, the audience and panel explored the topic, “Is this failure worth analyzing?” The panel represented industries suchas automotive, electronic semiconductors, medical devices, foundry fab, and assembly manufactur- ing. As panelists answeredaudience inquiries, adiscussion ensued regarding whether to analyze or not, and consid- ered the consequences of each choice. NEW User Group Format: Patrick Pardy, Intel; Anita Madan, GlobalFoundries; Tejinder Gandhi, Maxim Integrated Over 80 attendees participated in each of the User Groups (UG), which included FIB, Contactless Opti- cal Nanoprobing, and Sample Preparation. A moderated EDFAS President Lee Knauss recognizes the ISTFA 2018 Organizing Committee Members during the General Membership Meeting.