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edfas.org 25 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 1 necessary to meet the thermal challenges presented by today’s advanced devices. The TTI technique depends on observing and mea- suring reflectivity changes as a function of temperature when the device is illuminated with wavelengths in the visible range. With an illuminationwavelength of 365 nm, a spatial resolution of 245 nmwith a temporal resolution of 50 ns has been demonstrated. Time averaging enables excellent temperature resolution and power sensitivities less than 50 µW. With these capabilities, TTI can be used to locateminute defects ondevices by detecting the location of hot spots due to the presence of defects. It can also be used to characterize device performance by tracing the transient thermal response during operation. Several examples illustrate the value of this approach in detecting thermal anomalies and defects that likely would be missed using other techniques. REFERENCES 1. D. Kendig: “How-To Course 4: Thermal Imaging Based on the Thermoreflectance Principle,” 32nd IEEE SEMI-THERM Symposium, 2016. 2. J.H.L. Ling, A.A.O. Tay, K.F. Choo, W. Chen, and D.Kendig: “Thermal Characterization of a Power Amplifier MMIC Using Infrared and Thermoreflectance Thermography,” Int. Symp. Phys. Fail. Anal. Integr. Circuits (IPFA), 2012. 3. P.E. Raad, P.L. Komarov, and M.G. Burzo: “Thermo-Reflectance Thermography for Submicron Temperature Measurements,” Elec- tronics Cooling, 14 (1), 2008. 4. K. Yazawa, D. Kendig, P.E. Raad, P.L. Komarov, and A. Shakouri: “Understanding the Thermoreflectance Coefficient for High Resolution Thermal Imaging of Microelectronic Devices,” Electronics Cooling, 19 (1), 2013. 5. Thermal Engineering Associates Tech Brief (TB-15), http://www. thermengr.net/TechBrief/TB-15.pdf. 6. D. Kendig, K. Kazawa, and A. Shakouri: “Transient Thermal Meas- urement and Behavior of Integrated Circuits,” 29th IEEE SEMI-THERM Symposium, 2013. 7. K. Yazawa, D. Kendig, and A. Shakouri: “Time-Resolved Thermo- reflectance Imaging for Thermal Testing and Analysis,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2013. 8. D. Kendig, Meeting the Thermal Challenges for the Design of High Power GaN HEMT Devices, MicroApps Session, International Microwave Symposium (IMS), 2018. ABOUT THE AUTHORS DougGray receivedaB.E.E. degree fromNewYorkUniversity School of Engineering andanM.S.E.E. from Stanford University. He currently serves as technical director at Microsanj LLC. Prior to join- ing Microsanj, he served in key management positions as senior director for product manage- ment at Ensemble Communications; chief technical officer for the broadband networks division at Lucent Technologies; and general manager of the wireless systems unit at Hewlett-Packard, now Keysight Technologies. Dustin Kendig received a B.S. with honors in electrical engineering from the University of California, Santa Cruz. His research focused on device characterization using ther- moreflectance imaging, where he studied microscopic defects in photovoltaics, heating in power transistor arrays, and thermoelectric devices. Kendig currently serves as vice president of engineer- ing for Microsanj LLC. AndrewTay is anadjunct professor at theSingaporeUniversity of Technology and Design, formerly professor of mechanical engineering at the National University of Singapore, and a consultant. He obtained his B.E. (Hons I and University Medal) and Ph.D. inmechanical engineering from the University of NSW, Australia. His research interests include electronics packaging, thermal management of electronic systems and EV batteries, thermore- flectance thermography, solar photovoltaics, and fracture mechanics. He is a fellow of ASME and member of IEEE. Ali Shakouri obtained his Diplome d’Ingenieur from Ecole Nationale Superiere des Telecommunications, Paris, and received his Ph.D. from the California Institute of Technology. He is currently director of the Birck Nanotechnology Center and professor of electri- cal and computer engineering at Purdue University. His research focuses on nanoscale heat and current transport in semiconductor devices, high resolution thermal imaging, and waste heat recovery. Shakouri is a cofounder of Microsanj and serves as chairman of the company’s technical advisory board.