February_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 1 10 Advertise in Electronic Device Failure Analysis magazine! For information about advertising in Electronic Device Failure Analysis , contact Erik Klingerman, National Account Manager; 440.840.9826; Erik.Klingerman@asminternational.org. Current rate card may be viewed online at asminternational.org/mediakit. GUEST EDITORIAL CONTINUED FROM PAGE 2 Another reason for the switch from a newsletter to magazine format was the desire of more advertisers to get theirmessages in front of EDFASmembers. Advertising provides value in communicatingmarketingmessages to readers and yields financial advantages to the publication. Larry had the foresight to know there should be a healthy balance between advertising and technical content. Still today in editorial boardmeetings, an occasional reference is made to the “Wagner Rule” of suggested advertising/ editorial percentages. After stepping down as editor in 2002, Larry remained an active mentor to his successive editors and the entire editorial board. And characteristic of Larry, he continues to leadby example. Note that Larry compiled the “Product News” department in every single issue until his retire- ment from the editorial board. EDFAS and EDFA magazine owe much of their success and future to a few hardworking individuals, especially LarryWagner. Wewould be remiss if we did not remember that our Society is built on its volunteer members. Larry is one whose exceptional service spans all of EDFAS. It is with gratitude to a personal mentor and friend that I, the editorial board, EDFAS, and all of the extended failure analysis community say “Thank you, Larry.” 2019 IRPS CONFERENCE The IEEE International Reliability Physics Symposium’s (IRPS) annual conference will be held March 31 to April 4 at the Hyatt Regency in Monterey, Calif. The IRPS technical program includes technical sessions, keynotes and invited talks on emerging issues, tutorials, workshops, poster sessions, a year-in-review seminar, and equipment demonstrations. Special attention is given to the reliability of advanced CMOS scaling, new materials introduction, new processes or integration strategies, and/or fun- damentally new device architectures. Attendees returning from IRPS will be better equipped to solve critical reliability problems and develop effective qualification procedures that affect their company’s bottom line. The IRPS Conference is sponsored by the IEEE Reliability Society and IEEE Electron Devices Society. The 2019 event will be held jointly with the International Electrostatic Discharge Workshop (IEW). For more information, visit the IRPS website at irps.org . NOTEWORTHY NEWS 2019 FIB SEMMEETING The 12th annual FIB SEM Meeting will be held May 6-7 at George Washington University in Washington, D.C. It will feature presentations, tutorials, and posters by FIB users and vendors, high- lighting new applications and the latest technology. The event offers plenty of technical content as well as opportunities for informal discussions with your FIB colleagues. For more information, visit fibsem.net or email keana.scott@nist.gov .