February_EDFA_Digital

edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 1 DEPARTMENTS An Automated Methodology for Logic Characterization Vehicle Design Zeye Liu, Ben Niewenhuis, Soumya Mittal, Phillip Fynan , and R.D. (Shawn) Blanton The Carnegie Mellon Logic Characterization Vehicle has been introduced to address the challenges facing conv en- tional product-like test chips. Experimental results show it achieving SSL and IP fault coverages comparable or better than benchmarking designs. ABOUT THE COVER “The Fire Inside.” Visible light-illuminated view of a backside ultrathinned flip chip, showing emerging circuitry. Photo by Tim Hazeldine, Ultra Tec, First Place Winner in Color Images, 2018 EDFAS Photo Contest. Author Guidelines Author guidelines and a sample article are available at edfas.org . Potential authors should consult the guidelines for useful informa- tion prior to manuscript preparation. 4 12 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS FEBRUARY 2019 | VOLUME 21 | ISSUE 1 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS 2 GUEST EDITORIAL Ed Cole 35 CALL FOR PAPERS 36 PANEL & USER GROUP SUMMARY 44 BOARD OF DIRECTORS NEWS Ryan Ro ss 45 CALL FOR NOMINATIONS Zhiyong Wan g 46 2018 EDFAS AWARD WINNERS 47 2019 EDFAS AWARDS 48 DIRECTORY OF FA PROVIDERS Rose Ri ng 50 PRODUCT NEWS Ted Kolasa 52 TRAINING CALENDAR Rose Ring 54 LITERATURE REVIEW Mike Bruce 56 ADVERTISERS INDEX Ensuring Advanced Semiconductor Device Reliability using FA and Submicron Defect Detection Dusty Gray, Dustin Kendig, Andrew A.O. Tay, and Ali Shakouri A noninvasive thermal imaging approach based on the thermoreflectance principle is proposed for analyzing today’s advanced semiconductor devices. Several exam- ples illustrate the value of this approach in detecting ther- mal anomalies and defects missed by other techniques. 20 For the digital edition, log in to edfas.org, click on the “News/Magazines” tab, and select “EDFA Magazine.” Machine Learning Inside the Cell to Solve Complex FinFET Defect Mechanisms with Volume Scan Diagnosis Manish Sharma and Yan Pan This article describes a breakthrough technique in the field of scan diagnosis andmachine learning that finds defects inside of FinFETs, diagnoses the root cause, and improves FA success rates and efficiency. 12 4 Fuse Burnout due to Gate Drive Circuit Parasitic Ringing in DC/DC Converters Guo Xianxin Much attention is given toDC/DC converter failures ca used by reliability factors. This article sheds light on the le sser explored failure analysis of the gate drive circuit along with possible solutions. 26 20 26 ISTFA 2018 Highlights A recap of the ISTFA 2018 event includes General Chair Efrat Moyal’s wrap-up as well as a list of the winning ISTFA papers and posters. 32