November_EDFA_Digital

edfas.org 53 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 4 differential phase contrast imaging, tomography (STEM& TEM), electrostatic biprism for electron holography, x-ray based imaging technology (nano- andmicro-X-CT: 2D, 3D, 4D), XPCI, SAXS, x-ray tomography (macro, micro, nano- CT), SC-XRD, HRXRD, and SAXS. INNOVATIVE CIRCUITS ENGINEERING (ICE) 2310 Lundy Ave. San Jose, CA 95131 408.955.9505 serena@icengin.com icenginc.com/failure-analysis-testing-services Services Offered: Reliability testing, PCB design and as- sembly, burn-in services, ESD testing, and failure analysis. Tools and Techniques: Preconditioning, temperature cycling testing, thermal shock, autoclave or pressure pot, high-temp and low-temp storage, cycled temp humidity bias, HAST test, power temp cycles, temperature humid- ity bias test, BLRT, ELFR, LOL, HTOL, lumen maintenance test, RF HOTL (CW, GSM and others), external visual in- spections, curve tracing, x-ray, CSAM acoustic analysis, probing, liquid crystal analysis, emissionmicroscopy, and thermal emissions. METALLURGICAL ENGINEERING SERVICES (MES) 845 E. Arapaho Rd. Richardson, Texas 75081 972.480.0033 sales@metengr.com metengr.com Services Offered: Mechanical testing, failure analysis, chemical analysis, nondestructive testing, environmental testing, surface analysis, welding analysis, and accident investigation. Tools and Techniques: SEM, WDS, EDX/EDS, real-time x-ray, corrosion testing, soldering analysis, fracturemode and mechanism, coating characterization, profilometer, replication metallographic analysis, strain gauge, tensile pull testing, Rockwell, Brinell, andmicrohardness testing, durometer hardness testing, yield strength and elonga- tion, fracture toughness testing, friction andwear testing, adhesion and peel testing. METALS ENGINEERING AND TESTING LABORATORY (METL) 2040 W. Quail Ave. Phoenix, AZ 85027 800.658.5836; 602.272.4571 mgiboney@metl.com metl.com Services Offered: Failure analysis, chemical analysis, mechanical testing, metallurgical analysis, expert witness testimony and consulting, reverse engineering, fastener testing, aviation services, welder qualification, warranty issues, materials and process problem solving, turbine engine component testing, and electronic device testing. Tools and Techniques: SEM/EDX, vacuumOES, ICP, clas- sical wet chemical analysis, metallography, microhard- ness testing, digital imaging, microstructural testing and analysis, plating/coating thickness and quality, grain size, case depth, inclusion rating, porosity, corrosion, salt spray corrosion (ASTM B117, B368), taber abrasion, shelf life recertification (non-metallics), coefficient of friction, paint adhesion, stress corrosion, hydrogenembrittlement, solderability, susceptibility to intergranular attack, coating adhesion, shore hardness polymers, density/specific gravity (polymers), electrical conductivity, and thermal barrier coating strength. ROOD MICROTEC TECHNOLOGY AND FAILURE ANALYSIS +44 (0)711 86709 42; +49 (0)711 86709 44; +49(0)162 2596515 roodmicrotec.com/en/contact/contact-sales Services Offered: Extended supply chain management, test engineering, test operations, qualification and reli- ability tests, failure and technology analysis, device programming, Competence Centre for Reliability and Consultation, technological analysis, failure analysis, nondestructive and destructive physical analysis, mate- rial analysis, authenticity verification tests, and ESD certification. Tools and Techniques: IC design modifications and FIB cross-sections, x-raymicroscopy, x-ray computed tomog- raphy, SAM, visual control andwhisker inspection, metal- lography, measurement of ionic contamination, SEM and EDX spectroscopy, spectroscopic and chromatographic methods, dye penetration inspection, PIND, leak tests, plastics testing, life tests, burn-in and run-in, HAST and autoclave, THB, environmental simulations and artificial agingbymeans of environmental tests from − 70° to+300°C and 10 to 98 percent humidity (constant, cyclical, or shock), andmechanical tests (shock, bump, or vibration). WINTECH NANO-TECHNOLOGY SERVICES 10 Science Park Rd. 03-26 The Alpha, Science Park II Singapore 117684 +65 67777354 sales@wintech-nano.com wintech-nano.com Services Offered: Failure analysis, IC circuit edit, and materials characterization. Tools and Techniques: Encapsulation, FIB, EMMI, TIVA, SEM, TEM, EDX, AFM, TOF-SIMS, D-SIMS, TXRF spectros- copy, AES, XPS, FTIR spectroscopy, EDX spectroscopy, and AFM.