February_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 1 54 DIRECTORY OF INDEPENDENT FA PROVIDERS Rosalinda M. Ring, Kionix rring@kionix.com E lectronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. ADVANCED CIRCUIT ENGINEERS 308 South Abbott Ave. Milpitas, CA 95035 Tel: 408.719.1617 e-mail: sales@advancedcircuitengineers.com Web: acellc.net Services: Electrical and physical FA, elemental analysis, etc. Tools/Techniques: Front-side and flip-chip circuit edit, dual beam (FIB/SEM), TEM sample prep, TEM, HR-STEM, EDS, EELS, holography, tomography, etc. ALTER TECHNOLOGY TÜV NORD C/. Tomas Alba Edison, 4 41920 Sevilla, Spain Tel: +34 95 446 70 50 Web: wpo-altertechnology.com Services: FA, electrical testing and characterization, counterfeit detection, etc. Tools/Techniques: SEM, EDS, FTIR, SIMS, XPS, cross sec- tions, CSAM, bondpull test, die shear test, FIB, glassivation integrity test, PIND test, optical inspections, etc. EBATCO NANO ANALYTICAL AND TESTING LABORATORY SERVICES 7154 Shady Oak Rd. Eden Prairie, MN 55344 Tel: 952.941.2199/844.332.2826 e-mail: info@ebatco.com Ebatco Suzhou Office Guohua Building A303 Chongwen Rd., 328 Xinghu St. Suzhou Industrial Park, Suzhou Jiangsu 215021, China Tel: +86 512 6258 0632 e-mail: suzhouinfo@ebatco.com Web: ebatco.com Services: Analytical testing services, surface characteriza- tion, thin-film and contamination analyses, microscopy, etc. Tools/Techniques: SEM-EDS, FTIR, AFM, SPM, white light interferometry, nano- and microindentation, nano- and microscratch, friction, wear, DMA, TMA, DSC, TGA, particle and pore sizing, contact angle, surface/interface tension, etc. HI-REL LABORATORIES 6116 N. Freya Spokane, WA 99217 Tel: 509.325.5800 / Web: hrlabs.com Services: FA, destructive physical andmaterials analyses, etc. Tools/Techniques: C-SAM, 2-D real-time/3-D computed tomography x-ray imaging, SEM imaging, EDS, FTIR, FIB cross sections, optical microscopy, external visual inspec- tion, delid, PIND, bond pull, hermeticity, residual gas analysis, die shear, etc. INSIDIX 14 rue Henri Dunant 38180 Seyssins, France Tel: +33 (0)4 38 12 42 80 e-mail: insidix@insidix.com Web: http://www.insidix.com Services: FA, training, sales, etc. Tools/Techniques: CSAM, 2-D real-time/3-D computed tomography x-ray imaging, lock-in and dynamic infrared thermography, topography and deformation measure- ments, etc. MASER ENGINEERING B.V. Capitool 56 7521 PL Enschede The Netherlands Tel: +31 53 480 26 80 P.O. Box 1438 7500 BK Enschede The Netherlands Tel: +31 53 480 26 70 e-mail: info@maser.nl / Web: maser.nl Services: Nondestructive physical, construction, failure, andmaterials analyses; test anddiagnostic services; quali- fication, mechanical, ESD, latch-up, and environmental tests; board-level reliability; consulting; training; etc. Tools/Techniques: SEM-FIB, scanning probe, SEM/EDX, and optical microscopies; TEM sample prep; 2-D real- time/3-D computed tomography x-ray imaging; CSAM; curve tracing; CCD/InGaAs PEM; absolute/lock-in ther- mography; AFM; EOTPR; FEG-STEM; STEM-HAADF; laser- assisted fault localization/OBIRCH; FTIR microscopy and analysis; SIMS; x-ray fluorescence and diffraction analysis; scanning ESCA microprobe; etc.