November_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 4 64 Accelerated Analysis...................................................... 64 Allied High Tech.................................................. 32-33, 47 ASM International.......................................................... 34 Buehler........................................................................... 10 Checkpoint................................................................ 58-59 Hamamatsu. .................................................................... 7 IR Labs............................................................................ 39 JEOL. .................................................. Outside back cover Kleindiek Nanotechnik GmbH....................................... 61 Mentor, A Siemens Business.....................................47, 55 Neocera.......................................................................... 53 Oxford............................................................................. 35 Quantum Focus Instruments...................................11, 49 Quartz Imaging.........................................................25, 47 SELA................................................................................ 48 Semicaps........................................................................ 21 TESCAN USA Inc............................................................. 45 ULTRA TEC.................................. Inside front/back covers XEI Scientific..............................................................47, 57 Zeiss................................................................................ 19 Zurich Instruments.......................................................... 3 For advertising information and rates , contact: Erik Klingerman, National Account Manager; tel: 440.840.9826; e-mail: Erik.Klingerman@asminternational.org . Current rate card may be viewed online at asminternational.org/mediakit. INDEX OF ADVERTISERS A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS Visit the Electronic Device Failure Analysis Society website edfas.org ABOUT THE COVER a) “Land of Delineation.” Delineated silicon imaged with differential interference contrast microscopy. Photo by Eric Cattey, NXP Semiconductors, Second Place Winner, Color Images. b) Ribbon of titanium. Peeling via liner due to residue on wafer postetch. Photo by Lori Sarnecki, Fairchild Semiconductor, Second Place Winner, Black & White Images. c) Scanning electron microscopy image of a chip inductor lifted bond wire. The lifted wire was found after solder reflow and conformal coating. The bond wire lifted cleanly off the pad, with conformal coating observed along the bond interface. This indicated that the failure occurred prior to or during the conformal coating process. The temperature profile of the solder reflow process may have exceeded the required limit. False color was used to take advantage of the charging effect from the conformal coating. Photo by Luigi L. Aranda, Raytheon, Second Place Winner, False Color Images. d) Warning: Psychedelic images may appear after extensive microscopic analysis! Visible light analysis of samples with very thin remaining silicon requires perfectly planar sample preparation. In this image, solder balls create interference patterns during VIS (660 nm) laser scanning microscopy of a cracked device. Photo by Philipp Scholz and Heiko Lohrke, Technische Universität Berlin, Third Place Winner, Black & White Images. e) Optical image of broken bond wires on a field-effect transistor upon decapsulation. The majority of the bond wires were found to be fractured. Photo by Richard Park, Raytheon, Third Place Winner, Color Images. f) Scanning electronmicroscopy image of a gold-germaniumbraze joint/substrate attach. False colorwas used to enhance the image, which resembles Santa Claus. Photo by Andrew Ozaeta, Raytheon, Third Place Winner, False Color Images. All images from the 2016 EDFAS Photo Contest.