November_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 4 54 DIRECTORY OF INDEPENDENT FA PROVIDERS Rosalinda M. Ring, Qorvo Corp. Rosalinda.Ring@qorvo.com E lectronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. ANALYTICAL SOLUTIONS — ALBUQUERQUE DPA & FA Services 10401 Research Rd. SE Albuquerque, NM 87123 Tel: 800.622.2382/505.299.1967 Web: integra-tech.com/analytical-solutions Services: Destructive physical, failure, and construction analyses; counterfeit IC detection; etc. Tools/Techniques: External/internal visual inspection; x-radiography inspection; PIND; seal fine and gross leak testing; dye penetrant testing; XRF; bond pull and die shear; ball shear; copper wire evaluations; FIB editing; physical dimension; marking permanency; AC, DC, and full functional electrical test; 150 to 200 °C temperature test; OEM date code verification; blacktop test; burn-in/ qualification; solderability testing; etc. FAST ANALYSIS LABORATORIES, INC. 1135 E. Arques Ave. Sunnyvale, CA 94085 Tel: 408.868.2948 e-mail: service@fa-labs.com Web: fa-labs.com Services: Electrical and physical failure analyses, nonde- structive analysis, package analysis, sample preparation, reverse engineering, consulting, etc. Tools/Techniques: Advanced laser decapsulation of copper wire, chemical delidding, backside bulk silicon sample preparation, bulk laser marking and cutting, dye and pry, electrical analysis and curve tracing, fault isola- tion (front and backside) withOBIRCH, FIB circuit edit and cross sectioning, high-resolution digital optical micros- copy, IR inspection, SEM/EDS, real-time x-ray inspection, wet and parallel lap deprocessing, etc. IEC ELECTRONICS 105 Norton St. Newark, NY 14513 Tel: 315.331.7742/888.688.3570 e-mail: info@iec-electronics.com Web: iec-electronics.com Services: Material analysis testing, detection and avoid- ance of counterfeit components Tools/Techniques: Destructive physical analysis, failure analysis, decapsulation, SEM, cross-sectional analysis, 3-D x-ray inspection, XRF, optical microscope, dye and pry, microhardness testing, strain gage testing, compres- sion and tensile testing, FTIR/TGA, SEM/EDX (elemental mapping), bond/die shear, wire pull, delidding and decapsulation, etc. ITRI INNOVATION Unit 3, Curo Park Frogmore, St. Albans Hertfordshire, AL2 2DD, U.K. Tel: +44 (0) 1727 875 544 e-mail: wayne.lam@itri.co.uk Web: itri.co.uk Services: PCB quality control, reliability testing, failure analysis, counterfeit components testing, consulting, etc. Tools/Techniques: Dye andpry analysis,microsectioning, optical microscopy inspection, SEM/EDX analysis, solder- ability testing, thermal cycling testing, x-ray inspection, etc. MICROLABS SCIENTIFIC, LLC 100 Burtt Rd., Suite 125 Andover, MA 01810 Tel: 978.409.2812 e-mail: contact@microlabsscientific.com Web: microlabsscientific.com Services: Analytical, consulting, and failure analysis services Tools/Techniques: SEM, EDS, FIB milling, optical pro- filometry, thermal imaging, film-thicknessmeasurement, optical microscopy, vibration measurements, etc. MICROTECH LABORATORIES, LLC 538 Haggard St., Suite 402 Plano, TX 75074 Tel: 972.633.0007 e-mail: contact@micro-labs.com Web: microtechlaboratories.com Services: Turn-key failure analysis, component analysis, PCB analysis, reverse engineering, construction analysis, sample preparation, consulting and training, etc. Tools/Techniques: Real-time x-ray, scanning acoustic microscopy, SEM/EDX (elemental mapping), backscat- tered or secondary electron imaging, backside sample preparation, decapsulation (die exposure), die deprocess- ing, emissionmicroscopy, liquid crystal, FIB, cross section, mechanical probing, etc.