November_EDFA_Digital

edfas.org 53 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 4 entry-level configura- tion while preserving the option to upgrade to full Nanoprober system capability in the future. The Themi s S system is Thermo Fisher’s latest ad- dition to the industry- standard Themis TEM platform. Targeted to the needs of semicon- ductor failure analysis labs working at the sub-20 nm technol- ogy node, the Themis S system is designed for high-volume semi- conductor imaging and analysis and includes an integrat- ed vibration-isolation enclosure and full remote-operation capability. The probe-corrected 80 to 200 kV column, automated alignments, XFEG source, and DualX x-ray spectrometer provide robust, sub-Ångström imaging and fast, accurate elemental and strain analysis. “We have customers working on a wide variety of devices, from the most advanced memory and logic at the sub-20 and even 7 nm nodes, to more mature device technology that is still critically important and used in many state-of-the-art applications, like smart phones and IoT products,” said Krueger. “Our suite of failure analysis tools covers a diverse set of semiconductor customers with a wide array of requirements.” For more information: web: thermofisher.com . BRUKER INTRODUCES TRIBOLAB SYSTEM Bruker’s Nano Surfaces Division announced the introduction of the TriboLab CMP Process and Materials Characterization System, which provides a unique characterization capability for the development of chemical mechanical polishing (CMP) processes on the proven robust Universal Mechanical Tester TriboLab platform. The new TriboLab CMP system is the only tool on the market that can provide a broad range of polishing pressure (0.05 to 50 psi), speeds (1 to 500 rpm), friction, acoustic emissions, and surface temperaturemeasurements for theaccurateandcomplete characterization of CMP processes and consumables. “CMP ismore critical than ever for advanced semicon- ductor device fabrication. The industry has been calling for ameans to effectively characterize the detailedprocess and consumables interactions that take place while pol- ishing awide range ofmaterials,” saidDr. Robert Rhoades, Chief Technology Officer of Entrepix, a leading provider of equipment and wafer-processing services to the CMP industry. “We arepleased topartnerwithBruker andassist in the launch of the TriboLabCMPplatform. With the addi- tion of this new system to our capabilities, we are poised to provide a reliable R&D solution for testing and charac- terization of complex interactions among pads, slurries, conditioning, and process parameters, with unmatched repeatability and detail.” For more information: web: bruker.com . The Themis S system