November_EDFA_Digital

edfas.org 43 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 4 The details and future work related to these activities are discussed elsewhere. [10] REFERENCES 1. N. Asadizanjani et al.: “Non-Destructive PCB Reverse Engineering Using X-Ray Micro Computed Tomography,” Proc. 41st Int. Symp. Test. Fail. Anal. (ISTFA), 2015. 2. N. Asadizanjani, M. Tehranipoor, and D. Forte: “PCB Reverse Engineering Using Nondestructive X-Ray Tomography and Advanced Image Processing,” IEEE Trans. Compon., Packag., Manuf. Technol., 2017, 7 (2), pp. 292-99. 3. S.E. Quadir, J. Chen, D. Forte, N. Asadizanjani, S. Shahbazmohamadi, L. Wang, J. Chandy, andM. Tehranipoor: “A Survey on Chip to System Reverse Engineering,” ACM J. Emerg. Technol. Comput. Syst. (JETC), 2015. 4. Z. Guo, B. Shakya, H. Shen, S. Bhunia, N. Asadizanjani, M. Tehranipoor, and D. Forte: “A New Methodology to Protect PCBs from Non-Destructive Reverse Engineering,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2016. 5. M. Alam, H. Shen, N. Asadizanjani, M. Tehranipoor, and D. Forte: “Impact of X-Ray Tomography on the Reliability of Integrated Circuits,” IEEE Trans. Dev. Mater. Reliab., 2017, 17 (1), pp. 59-68. 6. M.Holleretal.:“High-ResolutionNon-DestructiveThree-Dimensional Imaging of Integrated Circuits,” Nature, March 16, 2017, 543, pp. 402-06. 7. E.M. Lavely, Y.-S. Lai, K. Gopalakrishnan, and R. Thompson: “3D Element-Specific Bare Die Reconstruction with X-Ray Fluorescence Tomography,” Government Microcircuit Applications and Critical Technology Conference (GOMACTech), 2012. 8. “Rapid Analysis of Various Emerging Nanoelectronics (RAVEN),” IARPA, iarpa.gov/index.php/research-programs/raven. 9. M. Rowe: “Fake ICs: Another Weapon in Their Detection,” EDNNews, May 22, 2017, edn.com/design/test-and-measurement/4458370/ Fake-ICs--Another-weapon-in-their-detection. 10. E.L. Principe et al.: “Steps toward Automated Deprocessing of Integrated Circuits,” to appear in Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2017. SELECTED REFERENCES • M. Bajura, G. Boverman, J. Tan, G. Wagenbreth, C.M. Rogers, M. Feser, J. Rudati, A. Tkachuk, S. Aylward, and P. Reynolds: “Imaging IntegratedCircuitswith X-RayMicroscopy,” Government Microcircuit Applications and Critical Technology Conference (GOMACTech), 2011, pdfs.semanticscholar.org/b19e/ad21a9ff552398378ed847d- 17be19348ff61.pdf. • T.E. Collins III, J.D. Cali, D.A. Chan, D. Dimitrov, S. Turner, E. Lavely, and K. Gopalakrishnan: “Multimodal Imaging Techniques and Strategies for Mixed Signal Integrated Circuits,” Government Microcircuit Applications and Critical Technology Conference (GOMACTech), 2014. • E.M. Lavely, Y.-S. Lai, andK. Gopalakrishnan: “Joint Inversionof Multi- Mode Data for IC Estimation,” Government Microcircuit Applications and Critical Technology Conference (GOMACTech), 2013. ABOUT THE AUTHORS EdwardPrincipe obtained a Ph.D. in engineering science fromThe Pennsylvania StateUniversity. He has worked for more than 19 years in the area of instrument development for both ultrahigh- vacuum and high-vacuummicroscopy and spectroscopy equipment. He is the founder and current President of Synchrotron Research Inc., a designer and manufacturer of imaging near-edge x-ray- absorption fine structure tools. Dr. Principe has written two textbook chapters on the application of FIB-Auger and FIB-based 3-Dnanotomographic reconstruction. He holds twopatents in FIB-based 3-D reconstruction and has recently focused on the development of computational guided microscopy. NavidAsadizanjani received aPh.D. inmechanical engineering fromtheUniversity of Connecticut in 2014. He is an Assistant Professor with the Electrical and Computer Engineering Department at the University of Florida. His current research interest is on supply chain security and the assurance of everything. This covers a wide range of products, including electronic systems and devices, automo- tive parts, pharmaceuticals, medical devices, and so on. He is also involvedwith counterfeit detection and prevention, system- and chip-level reverse engineering, antireverse engineering, and so on. Domenic Forte received a B.S. degree in electrical engineering from Manhattan College in 2006 andM.S. and Ph.D. degrees in electrical engineering fromthe University of Maryland in 2010 and 2013, respectively. He is an Assistant Professor with the Electrical andComputer Engineering Department at the University of Florida. Dr. Forte’s research covers the entire domain of hardware security, from nanodevices to PCBs, with more than 100 publications. His research has been recognized through Best Paper awards and nominations. Mark Tehranipoor received a Ph.D. from the University of Texas at Dallas in 2004. He is currently the Intel Charles E. Young Preeminence Endowed Professor in Cybersecurity at the University of Florida. His current research projects include hardware security and trust, supply chain security, VLSI design, test, and reliability. Dr. Tehranipoor has published more than 300 journal articles and refereed conference papers and has given more than 150 invited talks and keynote addresses. He has published six books and eleven book chapters and serves on the program