edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 4 ABOUT THE COVER See page 40 for a description of the contest images collage on the cover. A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS NOVEMBER 2026 | VOLUME 28 | ISSUE 4 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS DEPARTMENTS Unveiling Via Sidewall Nanogaps: A Case Study of Low-Temperature Failures in a Transceiver Transformer Driver Angelly Crisar Entice-Gomez This article presents a comprehensive failure analysis of a cold temperature anomaly observed in a customerreturned isolated RS-485 transceiver with an integrated transformer driver. Author Guidelines Author guidelines and a sample article are available at edfas. org. Consult the guidelines prior to manuscript preparation. 4 12 2 GUEST EDITORIAL Marla L. Dowell and Anita Balaraman 3 CALL FOR PAPERS 30 EDFAS AWARDS 31 ASM AWARDS 32 BOARD CANDIDATE PROFILES Felix Beaudoin 37 DIRECTORY OF FA PROVIDERS Rosalinda Ring 39 LITERATURE REVIEW Michael R. Bruce 41 PRODUCT NEWS Ted Kolasa 43 TRAINING CALENDAR Rosalinda Ring 45 GUEST COLUMN 48 ADVERTISERS INDEX 3D Imaging of Integrated Circuits via Limited Angle X-ray Tomography Nathan Nakamura, Jordan Fonseca, Joseph W. Fowler, Felix H. Kim, Zachary H. Levine, John Henry Scott, Paul Szypryt, Andras E. Vladar, and Daniel S. Swetz This work shows 3D images of an integrated circuit at sub-100 nm spatial resolution and discusses key experimental considerations for achieving nanoscale x-ray computed tomography on planar semiconductor devices. 21 For the digital edition, log in to edfas.org, click on the “News & Magazines” tab, and select “EDFA Magazine.” Advanced Packaging Failure Analysis: Unleashing AI’s Full Potential Sam Lin Packaging-related defects have emerged as one of the dominant yield and reliability limiters for advanced AI hardware. The success of the 3DFabric Alliance therefore depends not only on advanced process integration, but also on the ability to rapidly detect, localize, and understand packaging defects across multiple length scales, enabling faster learning cycles, improved yield ramp, and robust field reliability. 12 4 21
RkJQdWJsaXNoZXIy MTYyMzk3NQ==