edfas.org 35 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 3 HAMAMATSU BOOTH 301 TED PELLA INC. Ted Pella Inc. announces the PELCO Dimpler provides automated precision thinning of specimens for TEM analysis, for deprocessing and failure analysis, and similar applications where targeted fine polishing is required. It is a precision electro-mechanical metallographic lapping instrument that will continuously monitor and control dimpling parameters and accurately terminate at a preset specimen thickness. Active monitoring of the Z-position, feedback-controlled damping, and automated controls for determining termination of processing work together to provide repeatable, reliable results in sample preparation. tedpella.com/Material-Sciences_html/ PELCO-Dimpler.aspx BOOTH 300 THERMO FISHER With over 40 years of semiconductor experience, Thermo Fisher Scientific is a trusted partner for failure analysis. The company’s end-to-end electron microscopy and fault isolation solutions help locate defects, investigate root causes, and characterize complex semiconductor devices with confidence. Visit the booth to discover workflows that enable atomic-resolution imaging, buried defect analysis, and process characterization to reveal what matters and support nextgeneration innovation. thermofisher.com/us/en/home/ semiconductors.html BOOTH 501 ULTRA TEC ULTRA TEC’s ULTRAPOL Advance is the leading all-in-one lapping and polishing workstation for the production of flat surfaces. A combination of advanced control and process features allow for the accurate processing of modern ICs through topside electronic deprocessing—enabled by the advanced optical enhancements such as our ULTRACOLLIMATOR. Applications include backside preparation of packages and wafers, particularly for flip-chips—and rapid global thinning of larger surfaces. The ULTRAPOL Advance offers cross-sectioning of die and package-level devices. ultratecusa.com BOOTH 419 Advance your failure analysis (FA) and identify defects quickly with Hamamatsu’s Dual PHEMOS-X emission microscope (C16506-01). Designed for both top- and bottom-side FA in one unit, the Dual PHEMOS-X eliminates the need to move wafers or dies to another system for two-sided optical analysis of advanced, 3D, nontransparent devices. hamamatsu.com/us/en/ product/semiconductor-manufacturing-support-systems/ failure-analysis-system/ C16506-01.html Riverwalk’s boat tour. The Alamo.
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