edfas.org 23 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 3 for Failure Analysis in 3D Quantum Information Technology,” Scientific Reports, 2025. 7. W. Liu, et al.: “SSD: Single Shot MultiBox Detector,” European ABOUT THE AUTHORS Guofeng You is a semiconductor failure analysis professional at Qualcomm in Singapore, where he focuses on fault isolation and driving efficient root-cause identification for product and customer support. He has nearly two decades of failure analysis experience across GlobalFoundries and Qualcomm. His recent focus is bringing AI and automation into real FA workflows to improve consistency, reduce cycle time, and scale day-to-day analysis. He received his Ph.D. in electrical and computer engineering from the National University of Singapore in 2009. Silambarasan Karuppannan is a semiconductor engineering professional with over fifteen years of experience in failure analysis, test engineering, and product engineering across advanced technology node products. He holds a bachelor’s degree in electrical and electronics engineering. After gaining broad test experience in various engineering roles early in his career, he advanced into test and failure analysis disciplines, specializing in advanced failure analysis at Qualcomm Singapore beginning in 2017. He currently serves as a staff engineer at Qualcomm Technologies in San Diego, continuing to advance failure analysis methodologies for semiconductor devices. Kan Sun received his bachelor’s degree in electrical engineering from Sichuan University, China, and his master’s degree in microelectronics from the National University of Singapore. He began his professional career as a failure analysis engineer at GlobalFoundries Singapore in 2012, where he gained hands on experience in semiconductor failure analysis across advanced technology nodes. In 2015, he joined Qualcomm’s FA team and is currently a senior staff engineer based in Singapore. With over 13 years of industry experience, Sun specializes in electrical fault isolation and failure characterization, supporting complex device and system level investigations. Wilson Lee Cheng Hoe holds a bachelor’s degree in electrical engineering, majoring in microelectronics, from Nanyang Technological University. He began his career in 2001 as a yield enhancement engineer at Chartered Semiconductor Manufacturing. In 2004, he joined United Microelectronics Corporation as a failure analysis engineer, further strengthening his expertise in semiconductor sectors. Hoe later moved to Qualcomm, where he serves as a staff engineer in failure analysis, specializing in advanced technology node electrical fault isolation for digital products. He currently leads a team of engineers supporting a broad portfolio of products across mobile, compute, data server, and automotive segments. Grace Tan is a director of engineering at Qualcomm Singapore, with 25 years of experience in semiconductor FA across leading global semiconductor companies. Her career spans roles at Xilinx, Intel, GlobalFoundries, and other major semiconductor organizations, giving her deep exposure to advanced process technologies and high-volume manufacturing environments. At Qualcomm, Tan leads engineering initiatives across multi functions and sites. She is recognized for her expertise in failure analysis, people leadership, and lab setup and operations, with a strong track record of building capable teams and scalable engineering capabilities. Tan holds a master’s degree in microelectronics from the National University of Singapore, which underpins her long standing technical leadership in the semiconductor industry. Visit the Electronic Device Failure Analysis Society website edfas.org Conference on Computer Vision (ECCV), 2016, p. 21-37. 8. N. Linarto, A. Phoa, and J.M. Chin: “Computer Vision for Photon Emission Microscopy,” Proc. IPFA, 2023.
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