edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 3 ABOUT THE COVER “A million dollar worm.” A low yield-issue with a potential loss of a million dollars led to bench testing, live x-ray, and EDX mappings. The root cause was caught and surprised everyone: An aluminum “worm” (orange) shorted two adjacent copper wires (blue). It even has a carbon “eye” (pink). Photo by Hongqi Deng, Analog Devices, First Place Winner in False Color Images, 2025 EDFAS Photo Contest. A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS AUGUST 2026 | VOLUME 28 | ISSUE 3 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS DEPARTMENTS Moisture and Microelectronic Devices Philipp wh Schuessler This article gives a simplified account of how Test Method 1018 for the determination of moisture in microelectronic devices evolved. Author Guidelines Author guidelines and a sample article are available at edfas.org. Consult the guidelines prior to manuscript preparation. 4 11 2 GUEST EDITORIAL Bob Keller and Rebecca Routson 30 SPECIAL ISTFA 2026 PREVIEW Kristofor Dickson 33 ISTFA 2026 EXHIBITORS LIST 34 ISTFA 2026 EXHIBITOR SHOWCASE 36 EDFAS 2026 PHOTO CONTEST 37 EDFAS 2026 VIDEO CONTEST 38 INTERNATIONAL EDFAS FA WORKSHOP SUMMARY 41 DIRECTORY OF FA PROVIDERS Rosalinda Ring 42 LITERATURE REVIEW Michael R. Bruce 44 PRODUCT NEWS Ted Kolasa 46 TRAINING CALENDAR Rosalinda Ring 48 ADVERTISERS INDEX Automated End-to-End AI Solution for Photon Emission Microscopy in Semiconductor Failure Analysis Guofeng You, Silambarasan Karuppannan, Kan Sun, Wilson Lee Cheng Hoe, and Grace Tan To address the limitations of photon emission microscopy (PEM), this article presents an end-to-end AI application for PEM analysis that integrates three capabilities into a single user workflow: automated hotspot detection, quantitative reference-to-target comparison, and layout correlation. 18 For the digital edition, log in to edfas.org, click on the “News & Magazines” tab, and select “EDFA Magazine.” Expanding the Application Range of Electron Beam Induced Resistance Change from Low- to High-Ohmic Failures Oscar Recalde-Benitez, Andreas Rummel, and Stephan Kleindiek By bridging the gap between EBAC and EBIC, EBIRCH provides a unified framework for analyzing a wide range of electrical defects without the need for high-voltage irradiation or destructive conditioning. 11 4 26 18 Leading the Charge in Building Today’s Microelectronics Workforce Errol Flynn The microelectronics industry is one of the most power- ful engines driving technological advancement, economic growth, and national security. To be a world leader, the United States must also lead in talent, and the Midwest Microelectronics Consortium is helping to lead that charge. 26
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