ASAP-t® I 5-AXIS DIGITAL MILL & POLISHER MEET 3D & CURVED/WARPED SURFACE CHALLENGES WITH ADAPTIVE MODULES +/- 0.4µm in overall uniformity in thinned area, +/- 0.12µm in required zone Combined Mapping & Polishing Control Generated data provides an adaptive model to obtain final RST and thickness profile Fluid Control System Dose & remove lubricants or abrasives while maintaining a live view of the process EXPANDING THE SAMPLE PREP TOOLKIT 'In Situ' RST Measurement - Single footprint system solution - Eliminates tilt/curve translation errors Ultra-High Res Cameras -All systems now include 3 UHD cameras at Target, 45° Side, and 45° Front positions - NEW NIR Illumination Mode provides through-silicon imaging Work with Overlays - Import Optical, X-RAY, and C-SAM images - Image manipulation tools include Rotate, Stretch, Resize, and Layer-Locking Unique Legacy Modules - Thermal Relaxation (heat & cool) stage -Automated Endpoint Module - Capacitance/Resistance based IN SITU THROUGH-SILICON RST MEASUREMENT Code Spectrometer Application UT-F3 NIR Standard thinning UT-VIS Visible Light Ultrathinning Extension (<10 microns) Two In Situ options are available for measuring and mapping remaining silicon thickness (RST). Toll Free (US) 1-877-542-0609 Tel: 1-714-542-0608 Fax: 1-714-542-0627 e-mail: info@ultratecusa.com www.ultratecusa.com
RkJQdWJsaXNoZXIy MTYyMzk3NQ==