edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 2 40 system failure into a precise design rule improvement closes the loop on reliability, ensuring that the high-speed interfaces of tomorrow are robust enough to withstand the unpredictable electrostatic environments of the real world. REFERENCES 1. “White Paper 4 — Understanding Electrical Overstress — EOS,” In- dustry Council on ESD Target Levels, August 2016, Revision 1.2, esdindustrycouncil.org/ic/en/documents/white-paper-4- elecrical-overstress. 2. O.R. Kachare: “Fault Isolation and Failure Analysis Techniques for the Development of Robust USB2 ESD Protection: EOS and ESD Fault Isolation and Fault Analysis Techniques on USB2 Lanes,” M.S. diss., California State University, Sacramento, 2020. ABOUT THE AUTHOR Omkar Rajesh Kachare earned his M.S. in electrical and electronic engineering from California State University, Sacramento, in 2020, with a focus on digital design and microelectronic architecture. Currently a product failure analysis engineer at Intel Corp., he specializes in debugging advancednode architectures for next-generation test chips, chipsets, and SOCs, with technical emphasis on scan diagnosis and complex logic failures. Advertise in Electronic Device Failure Analysis magazine! For information about advertising in Electronic Device Failure Analysis: KJ Johanns, Business Development Manager 440.671.3851, kj.johanns@asminternational.org Current rate card may be viewed online at asminternational.org/advertise. GUEST EDITORIAL CONTINUED FROM PAGE 2 and 3D heterogeneous integration architecture development is building momentum. Part of this effort concerns spreading more awareness about IRFA and ISTFA and promoting the participation of recognized FA experts as invited speakers. Take an active role in helping to determine the future state of FA development as we have been chronically undervalued and underfunded in recent history. The main goal here is to try to establish a more formal partnership with IEEE and the Semiconductor Research Corporation (SRC) to have EDFAS recognized as the semiconductor industry’s leader in electronic device failure analysis, validate and recognize each other’s work, and strengthen our brand and reputation across the wider semiconductor ecosystem. Some key outcomes of this activity have been the participation of various FA authorities as technical committee members and speakers in influencing IEEE conferences, programs, and panels as well as the addition of a dedicated failure analysis and fault isolation section in the second edition of the SRC’s Microelectronics and Packaging Technology Roadmap. Although the FAOC has implemented and achieved a lot so far, there is still much to be done. Therefore, anyone who is passionate about raising the awareness of FA and would like to get involved, please reach out and participate in this highly impactful and rewarding effort.
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