edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 2 24 17. S. Bossut, et al.: “Scanning Acoustic Microscopy Versus Colored Picosecond Acoustics to Detect Interface Defects in Hybrid Wafer Bonding,” Forum Acusticum, Dec. 2020, p. 2553-2554, doi. org/10.48465/fa.2020.0878. ABOUT THE AUTHORS Himanandhan Reddy Kottur is a doctoral researcher in the department of electrical and computer engineering at the University of Florida, where he has been working in the SCAN Lab since 2023. His research focuses on advanced semiconductor packaging, hybrid bonding reliability, and hardware security, with emphasis on nondestructive inspection techniques such as scanning acoustic microscopy, and optical characterization for defect detection and quality assurance. His work has been presented at leading venues including IEEE ECTC and IMAPS. Pavanbabu Arjunamahanthi is a Ph.D. student in electrical and computer engineering at the University of Florida, where he also earned his M.S. in materials science and engineering in 2025. His research focuses on advanced semiconductor packaging, particularly heterogeneous integration and next-generation interconnect technologies. He has developed interfacial defect taxonomies for hybrid bonding, advanced hybrid bonding cross-sectional imaging methodologies, and SAM frameworks for large-scale microbump analysis. Liton Kumar Biswas is currently a postdoctoral research associate in the department of electrical and computer engineering at the University of Florida, where he completed his Ph.D. He received his M.S. degree in applied physics, electronics, and communication engineering from the University of Dhaka, Bangladesh. His research focuses on identifying vulnerabilities through physical probing attacks, physical inspection, and reverse engineering, with a particular emphasis on security assurance in advanced packaging technologies, including 2.5D, 3D, heterogeneous integration (HI), and silicon photonics packaging. Istiaq Firoz Shiam is an Engineer II at the Florida Semiconductor Institute (FSI), University of Florida. He received his M.S. in electrical engineering from Texas State University, where he specialized in semiconductor material processing and characterization. Prior to joining FSI, he gained 3.5+ years of industry experience in electrical maintenance and project management and two years of academic research, with hands-on work on semiconductor fabrication and processing equipment including MOCVD, MBE, and HFCVD, as well as characterization tools such as FIB-SEM, XRD, XPS, and AFM. Katayoon Yahyaei is a Ph.D. candidate in electrical and computer engineering at the University of Florida, where she is a graduate research assistant. Her research focuses on applying artificial intelligence to improve the inspection, verification, and security of hardware designs and advanced packaging technologies. Her work has appeared in leading IEEE and SPIE venues, including ECTC and VTS. She has completed multiple graduate research internships at Texas Instruments and Lattice Semiconductor. Navid Asadi is an associate professor of electrical and computer engineering at the University of Florida, with affiliate appointments in materials science and engineering and radiology. He serves as deputy director for Research at the Florida Semiconductor Institute and directs the SCAN Lab (Security & Assurance Lab), which houses over $15M in advanced inspection and imaging infrastructure, including x-ray CT/laminography, acoustic microscopy, SEMEDS, and terahertz systems.
RkJQdWJsaXNoZXIy MTYyMzk3NQ==