edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 2 ABOUT THE COVER Microscopic Marvel: Dendritic crystal growth. A mesmerizing electron microscope image captures the intricate beauty of branched, tree-like crystalline formations. Photo by Maricel S. Capili, Analog Devices Inc., First Place Winner in Black and White Images, 2025 EDFAS Photo Contest. A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS MAY 2026 | VOLUME 28 | ISSUE 2 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS DEPARTMENTS Inspection and Metrology Challenges in Hybrid Bonding Himanandhan Reddy Kottur, Pavanbabu Arjunamahanthi, Liton Kumar Biswas, Istiaq Firoz Shiam, Katayoon Yahyaei, and Navid Asadizanjani This article outlines existing bottlenecks and proposes a pathway toward scalable and adaptive inspection methodologies suitable for next-generation chiplet-based integration. Author Guidelines Author guidelines and a sample article are available at edfas.org. Potential authors should consult the guidelines for useful information prior to manuscript preparation. 4 12 2 GUEST EDITORIAL Keith Serrels 25 ISTFA EXHIBITORS LIST 41 2026 PHOTO CONTEST 42 2026 VIDEO CONTEST 43 PRODUCT NEWS Ted Kolasa 46 DIRECTORY OF FA PROVIDERS Rosalinda Ring 48 LITERATURE REVIEW Michael R. Bruce 50 TRAINING CALENDAR Rosalinda Ring 52 ADVERTISERS INDEX International Roadmap for Failure Analysis: Die-Level Roadmap Council Kristofor Dickson and Venkat-Krishnan Ravikumar An update from the Die-Level Roadmap Council identifies six critical domains for innovation in electrical fault isolation over the next five years. 28 For the digital edition, log in to edfas.org, click on the “News & Magazines” tab, and select “EDFA Magazine.” Electrical Fault Localization of HighDensity 3D Interconnect Via Chains Through Innovative Sample Preparation Kristof J.P. Jacobs A novel approach is introduced that expands the applicability of optical-microscopy-based FA techniques, in- cluding LICA and OBIRCH, to increasingly downscaled device structures. 12 4 32 From System Zap to Silicon Improvement: Advanced Fault Isolation of USB2 Electrostatic Discharge Failures Omkar Rajesh Kachare This article presents a technical evaluation of a universal serial bus (USB2) interface failure within a platform controller hub following a system-level electrostatic discharge event. 32
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