ADVANCED MATERIALS & PROCESSES | NOVEMBER 2026 42 Fig. 1 — International Roadmap for Failure Analysis leadership team and council structure. A CALL TO ACTION FOR THE EDFAS COMMUNITY IRFA is not merely a document— it is a living, evolving tool designed to serve the stakeholders of the global electronic device failure analysis community. Member involvement is essential to its success, and the leadership team invites you to: • Explore and apply the roadmap to research, development, and planning efforts. • Share feedback to ensure the roadmap reflects emerging industry needs. • Volunteer expertise and join a worldwide network committed to advancing failure analysis. • Participate in outreach activities that raise awareness of FA’s pivotal role in semiconductor progress. Regular updates and progress reports are published in EDFA, the flagship magazine of EDFAS as well as on the IRFA home page. To learn more, find links to published articles, and to participate, visit the IRFA page at asminternational.org/edfas/fa-tech- nology-roadmap-committee. ~AM&P For more information: Vinod Narang, senior engineering manager, AMD Singapore, narang.vinod@amd.com. CURRENT IRFA LEADERSHIP TEAM GENERAL CHAIR Vinod Narang AMD CO-GENERAL CHAIR Felix Beaudoin, FASM GlobalFoundries ROADMAP ISTFA CO-CHAIR Lesly Endrinal Qualcomm PAST GENERAL CHAIR AND ROADMAP ISTFA CO-CHAIR Keith Serrels Hamamatsu Ryan Ross, FASM Intel Corp. David Su Consultant
RkJQdWJsaXNoZXIy MTYyMzk3NQ==